Glass Substrate (TGV)
Next-generation substrate with TGV and 5μm RDL
Glass Substrate (TGV)
Next-generation packaging substrate with Through Glass Via and 5μm/5μm RDL, featuring ultra-low CTE and high flatness.
Technical Specifications
| Substrate | Glass (Borosilicate / Quartz) |
| TGV Via Diameter | 30-100μm |
| RDL Line Width/Spacing | 5μm/5μm |
| CTE | 3-8 ppm/℃ |
| Surface Flatness | Extremely high |
| Metallization | Copper-filled vias |
| Max Panel Size | 300×300mm |
| Special Processes | TGV formation, Sputtering seed layer, Electroplating filling, Fine RDL |
Application Fields
✓Advanced IC Package Substrates
✓Optoelectronic Integration (Silicon Photonics)
✓MEMS Sensor Packaging
✓RF Front-End High-Density Packaging
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