Our Technology
Comprehensive expertise from design to assembly with cutting-edge capabilities
PCB Design & Engineering
We provide full-process design services from schematic to mass-production PCB layout, covering complex application scenarios including high-speed, high-density, RF, thick copper, and rigid-flex boards.
- ✓Professional Team: Senior hardware engineers & PCB Layout experts with average 10+ years experience
- ✓Design Capability: 2-48 layer boards, HDI micro-vias, stacked blind/buried vias, impedance control, high-speed signal integrity (SI) simulation
- ✓Process Adaptation: DFM/DFA analysis, stack-up design, material selection, structural clearance, thermal optimization
- ✓Software Proficiency: Cadence Allegro, Mentor PADS, Altium Designer, KiCad, etc.
- ✓Deliverables: Complete engineering data (Gerber, drill files, stencil, BOM, pick-and-place files)
Customer Support & Fast Response
From design consultation to after-sales support, we always respond quickly
24-Hour EQ Response
Engineering questions answered with solutions within 24 hours
NPI Support
Full-process technical support for new product introduction
Fast Prototyping
Fastest 24-hour prototype delivery, 5-7 days for multilayer samples
Global Delivery
Multi-factory collaboration ensuring on-time worldwide delivery
PCB Fabrication
We possess comprehensive manufacturing capabilities with high precision, full-process coverage, balancing both high-volume and quick-turn production, covering all stages from prototypes to mass production.
| Parameter | Standard | Advanced |
|---|---|---|
| Max Layers | 60 layers | 70 layers |
| Max Board Thickness | 8mm | 10mm |
| Max Finished Size | 1200×680mm | 1200×680mm |
| Outer Layer Min Line Width/Spacing | 3.5/3.5mil | 3.0/3.5mil |
| Inner Layer Min Line Width/Spacing (1OZ) | 3.5/3.5mil | 3.0/3.5mil |
| Inner Layer Min Line Width/Spacing (HOZ) | 2.8/2.8mil | 2.5/2.5mil |
| Aspect Ratio | 20:1 | 25:1 |
| HDI Any-layer Interconnect | 3+N+3 | 7+N+7 |
| Differential Impedance Control | ±10% | ±5% |
| Gold Finger Chamfer Tolerance | ±0.075mm | ±0.05mm |
| Registration Accuracy (Overall Layer Misalignment) | ±5mil | ±4mil |
| Max Back-drill Stub | 8mil | 6mil |
| Network Analysis Test Bandwidth | 26.5GHz | 43.5GHz |
| Min Mechanical Drill Hole Diameter | ≥0.15mm (6mil) | ≥0.13mm (5mil) |
| Min Laser Drill Hole Diameter | 50-150μm | 50-200μm |
| Resin Plugging Aspect Ratio | 25:1 | 30:1 |
| Max Inner Layer Copper Thickness (High-speed Hybrid) | 4oz | 6oz |
| Max Inner Layer Copper Thickness (Heavy Copper) | 15oz | 30oz |
| Hole Copper Thickness | 50μm | 100μm |
| Same Core Layer Misalignment | ±25μm | ±20μm |
| High Voltage Test Capability | Max 6000V DC 60S, leakage current 40μA | — |
| Surface Finish | ENIG, OSP, Immersion Tin, Immersion Silver, NiPdAu, Gold Finger, Soft Gold, Hard Gold, etc. | |
| Special Processes | N+N structure, hybrid press, HDI, deep micro-vias, step/long-short gold fingers, 2D code, POFV, back-drill, half-hole, metal edge plating, semi-plugging, embedded copper block, copper busbar, copper paste plugging, local heavy copper, rigid-flex, resin plugging, mechanical blind via, laser blind via, depth-controlled drilling, semi-flexible board, etc. | |
| Common Materials | S1000H, S1000-2M, IT-158, TU-865, VT-47, 370HR, etc. | |
| Reliability Testing | CAF, HAST, thermal shock, IST, solderability, ion contamination, etc. | |
| Heavy Copper Line Width/Spacing (by copper thickness) | 2oz: 6/6mil 2oz: 5.5/5.5mil 3oz: 8/8mil 3oz: 7/7mil 4oz: 10/10mil 4oz: 9/9mil 5oz: 12/12mil 5oz: 11/11mil 6oz: 14/14mil 6oz: 13/13mil | |
PCBA Assembly
We provide one-stop services including component sourcing, SMT placement, THT through-hole insertion, soldering, testing, conformal coating, and finished product delivery, supporting complex components and high-reliability products.
- ✓Process Capability: SMT high-speed placement, fine-pitch BGA/QFP, 01005 ultra-miniature components, through-hole insertion, wave soldering, reflow soldering
- ✓Placement Accuracy: ±25μm, supports 0.2mm BGA ball pitch
- ✓Inspection Capability: 3D AOI, X-RAY solder penetration inspection, ICT in-circuit testing, functional testing (FCT)
- ✓Material Management: BOM verification, alternative component evaluation, supply chain control, moisture/ESD protection management
- ✓Application Coverage: Industrial control, automotive electronics, communication, medical, new energy, consumer electronics
- ✓Delivery Mode: Prototype trial production, small batch, high-volume OEM/ODM manufacturing
Ready to Start Your Project?
Contact our engineering team for technical consultation and competitive pricing
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