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Success Cases

Real-world projects showcasing our expertise across industries

Automotive Electronics

ADAS Control Unit PCB

Challenge:

High reliability requirements for automotive safety systems with extreme temperature operation (-40°C to +125°C) and vibration resistance.

Solution:

Implemented 8-layer HDI design with impedance control, using automotive-grade materials and enhanced thermal management.

Results:

  • ✓IATF16949 certified
  • ✓AEC-Q100 compliant
  • ✓Zero defects in 100K+ units
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Medical Devices

Portable Patient Monitor

Challenge:

Miniaturization requirements for wearable health monitoring device with biocompatibility and long battery life.

Solution:

Designed 6-layer rigid-flex PCB with ultra-low power components and medical-grade surface finish.

Results:

  • ✓ISO13485 certified
  • ✓50% size reduction
  • ✓7-day battery life
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Communication

5G Base Station RF Board

Challenge:

High-frequency signal integrity requirements for 5G mmWave applications with precise impedance control.

Solution:

Used specialized high-frequency materials with Dk/Df control and laser drilling for microvias.

Results:

  • ✓Up to 40GHz operation
  • ✓±5% impedance tolerance
  • ✓Excellent signal integrity
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Industrial Control

PLC Controller Board

Challenge:

Long-term availability and harsh environment operation for industrial automation equipment.

Solution:

Implemented conformal coating and selected long-lifecycle components with 10+ year availability guarantee.

Results:

  • ✓15-year lifecycle
  • ✓-40°C to +85°C operation
  • ✓IP65 protection
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Consumer Electronics

Smart Home Hub

Challenge:

High-volume production with cost optimization while maintaining quality for consumer market.

Solution:

Optimized panel utilization and implemented automated assembly with AOI inspection.

Results:

  • ✓1M+ units shipped
  • ✓99.5% first-pass yield
  • ✓30% cost reduction
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Server/Computing

High-Performance Server Motherboard

Challenge:

High-speed signal integrity for DDR4/DDR5 memory and PCIe 4.0/5.0 interfaces with complex power delivery.

Solution:

Designed 20-layer server board with controlled impedance, back-drilling, and enhanced thermal vias.

Results:

  • ✓32Gbps data rate
  • ✓16-layer HDI
  • ✓Excellent signal integrity
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