Probe Card PCB
Core interface board for wafer testing
Probe Card PCB
30-layer high-temperature glass (HTG) FR4 probe card PCB for wafer testing applications with precise hole positioning and excellent thermal stability.
Technical Specifications
| Layer Count | 30 layers |
| Material | HTG FR4 (High Tg material) |
| Board Thickness | 6.35mm |
| Min Hole Diameter | 0.6mm |
| Surface Finish | ENIG |
| Special Processes | Precise hole positioning, High-temperature resistance, Multi-layer alignment |
Application Fields
✓Wafer Testing Equipment
✓Semiconductor Package Testing
✓IC Test Interface Boards
✓Chip Characterization Systems
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