Substrate-Like PCB (SLP)
Modified semi-additive process with ultra-fine lines
Substrate-Like PCB (SLP)
Advanced SLP using modified semi-additive process (mSAP) achieving ultra-fine line width ≤15μm for high-density interconnect applications.
Technical Specifications
| Line Width/Spacing | ≤15μm / 15μm |
| Process | mSAP (Modified Semi-Additive Process) |
| Density | High-density interconnect |
| Surface Flatness | Excellent flatness |
| Surface Finish | ENEPIG |
| Special Processes | mSAP process, Ultra-fine line etching, Surface planarization |
Application Fields
✓Advanced IC Package Substrates
✓High-End Smartphone Motherboards
✓Fine-Pitch BGA Substrates
✓Miniaturized Electronic Modules
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