Rigid-Flex Micro Assembly
Core module integration for wearable devices
Rigid-Flex Micro Assembly
Precision rigid-flex assembly service featuring micro-pitch BGA soldering, underfill process, X-ray inspection, and functional testing for wearable devices and medical sensor applications.
Technical Specifications
| BGA Type | Micro-pitch BGA |
| Underfill | Underfill process |
| Assembly Type | Rigid-flex assembly |
| Testing | Functional testing |
| Inspection | X-ray inspection |
| Special Processes | Fine-pitch soldering, Underfill dispensing, 3D AOI |
Application Fields
✓Wearable Devices
✓Medical Sensors
✓Portable Health Monitors
✓Smart Jewelry
Need Custom Rigid-Flex Assembly?
Contact our engineering team for professional recommendations and competitive pricing
Upload Gerber & Get Quote