High-Power Device Assembly
Thick copper/metal substrate power module assembly
High-Power Device Assembly
Power module assembly for thick copper and metal substrate boards, featuring aluminum wire bonding, thick copper wire soldering, heatsink assembly, and comprehensive insulation testing.
Technical Specifications
| Substrate Type | Thick copper board (up to 15oz) / Metal substrate |
| Bonding Process | Aluminum wire bonding / Thick copper wire soldering |
| Heat Sink Assembly | Heatsink mounting + Thermal interface material |
| Insulation Testing | 100% insulation withstand voltage test |
| Aging Test | High-temperature aging screening |
| Inspection Methods | AOI + X-ray + Functional testing |
| Special Processes | High-current trace reinforcement, Heatsink mounting torque control, Insulation testing |
Application Fields
✓New Energy Vehicle Motor Controllers
✓Industrial Variable Frequency Drive Power Modules
✓Photovoltaic Inverter Power Modules
✓High-Power Industrial Power Supplies
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