Super Thick Copper (15oz)

Power substrate carrying ultra-high current

Ultra-high current power substrate with 15oz outer copper thickness, designed for power modules and welding equipment applications.

Copper Thickness	Outer layer up to 15oz
Layer Count	2-4 layers
Board Thickness	1.6-4.0mm
Min Line Width/Spacing	8/8mil
Surface Finish	Immersion Tin / ENIG
Special Processes	5x solder mask printing, Local thick copper, Heavy copper plating

✓Power Supply Modules

✓Welding Equipment

✓High-Current Industrial Controllers

✓Battery Management Systems

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