High-Power Metal Substrate
Designed for high-current and high-heat dissipation requirements, ensuring efficient and stable operation of power systems.
Super Thick Copper (15oz)
Power substrate carrying ultra-high current
15oz Outer Copper2-4 Layers5x Solder MaskImmersion TinLocal Thick Copper
Power ModulesWelding Equipment
EV Winding Coil PCB
Board replacing wire, revolutionizing motor winding design
4-10oz CopperCoil Resistance≤3%2770V WithstandMetal Core CoolingENIG
New Energy VehiclesDrive Motors
Blind Slot Amplifier Board
Heat dissipation solution for RF amplifiers
Blind Slot StructureCopper Base InsertLow Thermal ResistanceENIG/Hard GoldHigh-Freq Hybrid
Communication Base StationsRF Amplifiers
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