Blind Slot Amplifier Board
Heat dissipation solution for RF amplifiers
Blind Slot Amplifier Board
Specialized heat dissipation solution for RF amplifiers featuring blind slot structure, copper base insert, and low thermal resistance design.
Technical Specifications
| Structure | Blind slot structure |
| Base Material | Copper base insert |
| Thermal Resistance | Low thermal resistance design |
| Surface Finish | ENIG / Hard gold plating |
| Material Type | High-frequency hybrid lamination |
| Special Processes | Depth-controlled milling, Copper insert pressing, Thermal via design |
Application Fields
✓Communication Base Station RF Amplifiers
✓RF Power Amplifier Modules
✓Microwave Communication Equipment
✓Radar Systems
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