High-Density SMT Assembly
Server/automotive ECU level precision assembly
High-Density SMT Assembly
Precision SMT assembly service capable of handling 01005 components and μBGA packages with ±25μm placement accuracy, featuring nitrogen reflow soldering and comprehensive AOI + flying probe ICT inspection.
Technical Specifications
| Min Component Size | 01005 / μBGA |
| Placement Precision | ±25μm |
| Reflow Soldering | Nitrogen (N2) reflow soldering |
| Inspection | AOI + Flying Probe ICT |
| Quality Control | 100% inspection |
| Special Processes | Fine-pitch soldering, BGA/X-ray inspection, Conformal coating |
Application Fields
✓AI Server Motherboards
✓Automotive ECU (Engine Control Unit)
✓High-Performance Computing Boards
✓Advanced Driver Assistance Systems (ADAS)
Need Custom SMT Assembly?
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