4-Order HDI
Ultra-high density interconnection, any-layer interconnect
4-Order HDI Rigid Board
Ultra-high density interconnection with any-layer interconnect for consumer electronics and automotive ADAS applications.
Technical Specifications
| Material | S1150G / S1151G / Autolad1G etc. |
| HDI Structure | 4+N+4 (Up to Anylayer) |
| Min Line Width/Spacing | 2.5/2.5mil |
| Laser Blind Via | 75-150μm |
| Mechanical Drilling | ≥0.15mm |
| Max Board Thickness | 3.2mm |
| Surface Finish | ENIG / ENEPIG / OSP |
| Special Processes | Any-layer interconnect, POFV, Resin filling, Via stacking |
Application Fields
✓High-end Smartphone Motherboards
✓Automotive ADAS Domain Controllers
✓Tablet/Laptop Motherboards
✓Wearable Device Core Modules
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