112G High-Speed Backplane
Ultra-low loss 112Gbps high-speed signal transmission for next-generation AI data centers
112G High-Speed Backplane
Ultra-low loss 112Gbps high-speed signal transmission solution for next-generation AI data centers and 800G/1.6T switches.
Technical Specifications
| Material | Ultra-low loss high-speed material (TU-865/EM-827 etc.) |
| Layer Count | Up to 42 layers |
| Board Thickness | ≤6.0mm |
| Min Line Width/Spacing | 3.0/3.5mil |
| Backdrill Stub | ≤6mil |
| Impedance Control | ±7% (±5% for 1OZ inner layer) |
| SI Test Bandwidth | 43.5GHz (Delta-L 4.0) |
| Surface Finish | ENIG / Immersion Tin |
| Special Processes | Backdrilling, POFV, Resin Filling, Embedded Capacitance/Resistance |
Application Fields
✓AI Training Server Motherboards
✓800G/1.6T Data Center Switch Backplanes
✓High-Performance Computing (HPC) Interconnect Backplanes
✓5G Transport Network Core Switching Equipment
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