Multilayer Rigid-Flex (20-36L)
High-complexity multilayer rigid-flex integration
Multilayer Rigid-Flex (20-36L)
High-complexity 20-36 layer rigid-flex PCB featuring air-gap technology, fly-lead design, symmetric stackup, and ENIG surface finish for industrial controllers and avionics applications.
Technical Specifications
| Layer Count | 20-36 layers flexible |
| Technology | Air-gap technology |
| Design | Fly-lead design |
| Stackup | Symmetric stackup |
| Surface Finish | ENIG |
| Special Processes | Multi-layer lamination, Controlled impedance, Z-axis expansion control |
Application Fields
✓Industrial Controllers
✓Avionics Systems
✓Test and Measurement Equipment
✓High-Reliability Electronics
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