High-Layer Rigid-Flex (≥40L)
Ultra-high complexity integrated molding
High-Layer Rigid-Flex (≥40L)
Ultra-high layer count rigid-flex PCB with ≥40 total layers, featuring multi-zone bending capability, embedded capacitance/resistance, and precise impedance control for military and aerospace applications.
Technical Specifications
| Layer Count | ≥40 layers total |
| Bending | Multi-zone bending |
| Embedded Components | Embedded capacitance/resistance |
| Impedance | Precise impedance control |
| Surface Finish | ENIG |
| Special Processes | High-layer stacking, Multi-zone forming, Embedded passive components |
Application Fields
✓Military Systems
✓Aerospace Equipment
✓Satellite Communication
✓Defense Electronics
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