Multilayer FPC
Ultra-thin flexible board with high-density routing
Multilayer FPC
2-8 layer ultra-thin flexible PCB with 0.08mm board thickness, minimum line width 1.5mil, and stiffener assembly for smartphone modules and wearable devices.
Technical Specifications
| Layer Count | 2-8 layers |
| Board Thickness | 0.08mm |
| Min Line Width | 1.5mil |
| Assembly | Stiffener assembly |
| Surface Finish | ENIG |
| Special Processes | Flexible coverlay, Stiffener bonding, Impedance control |
Application Fields
✓Smartphone Modules
✓Wearable Devices
✓Tablet Internal Connections
✓Compact Electronic Devices
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