HDI Flexible Board
Fine lines for high integration modules
HDI Flexible Board
High-density interconnect flexible PCB with 2+N+2 HDI structure, laser blind vias, and fine line width 1.2mil for camera modules and display driver applications.
Technical Specifications
| HDI Structure | 2+N+2 HDI |
| Laser Blind Via | 75μm |
| Min Line Width | 1.2mil |
| Via Type | Micro blind vias |
| Surface Finish | ENIG |
| Special Processes | Laser drilling, Fine line etching, Impedance control |
Application Fields
✓Camera Modules
✓Display Driver ICs
✓Smartphone Flexible Circuits
✓Wearable Device Interconnects
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